Global Three Dimensional Integrated Circuits (3D ICs) Market Outlook, Trend and Opportunity Analysis, Competitive Insights, Actionable Segmentation & Forecast 2024

Industry : Semiconductor & ElectronicsPublished Date : May 16th, 2018
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The global three dimensional integrated circuits market is expected to grow significantly from USD 6.8 billion to USD 13.9 billion, during the forecast period from 2018 to 2024 at a CAGR of 11.1%. Key factors driving the market growth are growing number of portable devices such as laptops, smart phones, tablets, and others, coupled with increasing adoption of efficient and compact functional chips, and rising demand for miniaturization in industries such as consumer electronics. Moreover, increasing demand for power efficient ICs with high-storage capacity is also driving the market growth.

The years used for the assessment are as follows:

  • Historical year : 2014, 2015 and 2016
  • Base year : 2017
  • Forecast period : 2018 – 2024

RESEARCH METHODOLOGY

The research and analysis is based on data and information obtained from various primary and secondary sources. The data obtained is validated by interacting with the companies of the concerned domain. The steps involved in the research methodology are:

  • Obtaining historical data of the market based on news, articles, publications, annual reports, white papers, and other secondary sources
  • Interacting with key opinion leaders of the market and developing data points based on interaction with them
  • Study of past trends in the market and their year on year impact on the market size and share
  • Analyzing the collected data points
  • Bridging the data points to calculate the total three dimensional integrated circuit market and it various segments
  • Anticipating potential risks
  • Analyzing market forces such as drivers, restraints, and opportunities to assess new growth areas for the global 3D ICs market
  • Finalizing the overall size and share for the global 3D ICs market 

OBJECTIVES:  

  • To classify the global three dimensional integrated circuit market, segments are classified in component, product, substrate, 3D technology, applications, region and analyze their growth prospects individually
  • To analyze market trends, opportunities, drivers and restraints associated with the global 3D ICs market
  • Profiling key companies operating in the global 3D ICs market
  • To study market response with respect to the mergers and acquisitions in the industry 

MARKET SCOPE

The research scope for global 3D ICs market is as follows:

By Component

  • Through Silicon Vias
  • Through Glass Vias
  • Silicon Interposer
  • Others

By Product

  • Sensors
  • Memories
  • Logics
  • Light Emitting Diodes (LED)
  • Micro-electro mechanical systems (MEMS)
  • Interposer
  • Others

By Substrate

  • Silicon on Insulator (SOI)
  • Bulk Silicon 

By 3D Technology

  • Wafer Level Packaging
  • System Integration

By Application

  • Consumer Electronics
  • ICT/ Telecommunication
  • Military
  • Automotive
  • Biomedical
  • Others 

By Region

  • Asia-Pacific (APAC)
  • North America
  • Europe
  • Middle East and Africa
  • Central and South America

Increasing Demand for Information and Communication Technology is Driving Growth for 3D-IC Market

The global three dimensional integrated circuits market is expected to reach USD 13.9 billion in 2024 at a CAGR of 11.1%. Key factors driving the market growth are; growing number of portable devices such as laptops, smart phones, tablets, and others, coupled with increasing adoption of efficient and compact functional chips, and rising demand for miniaturization in industries such as consumer electronics. Moreover, increasing demand for power efficient ICs with high-storage capacity is also driving the market growth. However, technological complexities associated with the 3D-ICs may inhibit the market growth to some extent.

3D-ICs are prominent in the market in comparison to the 2D-ICs. This development and growth is attributed to the optimum use of space with multi functional chip, which is made by stacking layer on layer. These layers are interconnected by a vias that go through the substrate. All the path of the communication is done by a lowest layer. Although, power management is always considered an issue, but 3D Integration can aid in improving and shortening interconnects, which in turn reduce the requirement for signal repeaters.

On the basis of component, through silicon vias (TSV) segment is a major segment owing to the ease of isolation of thermal coupling in 3D-ICs. Based on products, image sensors, and MEMS devices dominate the market. This growth is attributed to the adoption of 3D ICs in various industries. On the basis of substrate, silicon on insulator (SOI) accounted for the largest market share in 2017 and is expected to retain its dominance during the forecast period, owing to its use in minimizing the production of unwanted heat and parasitic capacitance. Based on application, information and communication technology segment dominates the global three dimensional integrated circuit markets owing to the increasing adoption of 3D IC integration technology.

Geographically, Asia-Pacific (APAC) held the largest share of the global 3D-ICs market. The growth in the region is attributed to the rapidly growing industries such as ICT and consumer electronics. Moreover, Asia- Pacific is expected to be the fastest growing market in 2017. The growth in the region is due to the rising technological advancement in 3D IC and rising demand of consumer electronics devices including smart phones, laptops, and other portable devices.

TABLE OF CONTENTS

CHAPTER 1. Market Scope and Methodology

1.1. Research methodology

1.2. Research scope & assumptions

1.3. List of data sources

CHAPTER 2. Executive Summary

2.1. Three Dimensional Integrated Circuit (3D-IC) – Market Snapshot

CHAPTER 3. Industry Analysis

3.1. Market definition

3.2. Market segmentation

3.3. Key findings of the 3D-IC Market

3.4. Value chain analysis

3.5. Market opportunities & trends

3.6. Market dynamics

3.6.1. Market driver analysis

   3.6.1.1. Growing number of portable devices

   3.6.1.2. Increasing adoption of power efficient functional chips

   3.6.1.3. Rising demand for miniaturization in various industries

3.6.2. Market restraint analysis

           3.6.2.1. Technological complexities

3.6.3. Industry Analysis-Porters five forces of analysis

CHAPTER 4. Competitive Outlook

4.1. Competitive analysis

4.2. Competitive factors

4.3. Strategies adopted

CHAPTER 5. Global 3D Integrated Circuit Market Size and Forecast (2014 – 2024)

5.1. Global 3D Integrated Circuit Market By Component (USD Billion)

5.1.1. Through Silicon Vias

5.1.2. Through Glass Vias

5.1.3. Silicon Interposer

5.1.4. Others

5.2. Global 3D Integrated Circuit Market By Product (USD Billion)

5.2.1. Sensors

5.2.2. Memories

5.2.3. Logics

5.2.4. Light Emitting Diodes (LED)

5.2.5. Micro-Electro Mechanical Systems (MEMS)

5.2.6. Others

5.3. Global 3D Integrated Circuit Market By Substrate (USD Billion)

5.3.1. Silicon on Insulator (SOI)

5.3.2. Bulk Silicon

5.4. Global 3D Integrated Circuit Market By 3D Technology (USD Billion)

5.4.1. Wafer Level Packaging

5.4.2. System Integration

5.5. Global 3D Integrated Circuit Market By Application (USD Billion)

5.5.1. Consumer Electronics

5.5.2. ICT/ Telecommunication

5.5.3. Military

5.5.4. Automotive

5.5.5. Biomedical

5.5.6. Others

CHAPTER 6. Global 3D Integrated Circuit Market Size and Forecast, By Geography

6.1. North America 3D Integrated Circuit Market (USD Billion)

6.1.1. North America 3D Integrated Circuit Market By Component (USD Billion)

6.1.2. North America 3D Integrated Circuit Market By Product (USD Billion)

6.1.3. North America 3D Integrated Circuit Market By Substrate (USD Billion)

6.1.4. North America 3D Integrated Circuit Market By 3D Technology (USD Billion)

6.1.5. North America 3D Integrated Circuit Market By Application (USD Billion)

6.1.6. North America 3D Integrated Circuit Market By Country (USD Billion)

   6.1.6.1. U.S.

   6.1.6.2. Canada

6.2. Europe 3D Integrated Circuit Market (USD Billion)

6.2.1. Europe 3D Integrated Circuit Market By Component (USD Billion)

6.2.2. Europe 3D Integrated Circuit Market By Product (USD Billion)

6.2.3. Europe 3D Integrated Circuit Market By Substrate (USD Billion)

6.2.4. Europe 3D Integrated Circuit Market By 3D Technology (USD Billion)

6.2.5. Europe 3D Integrated Circuit Market By Application (USD Billion)

6.2.6. Europe 3D Integrated Circuit Market By Country (USD Billion)

   6.2.6.1. Germany

   6.2.6.2. France

   6.2.6.3. U.K.

   6.2.6.4. Rest of Europe

6.3. Asia-Pacific 3D Integrated Circuit Market (USD Billion)

6.3.1. Asia-Pacific 3D Integrated Circuit Market By Component (USD Billion)

6.3.2. Asia-Pacific 3D Integrated Circuit Market By Product (USD Billion)

6.3.3. Asia-Pacific 3D Integrated Circuit Market By Substrate (USD Billion)

6.3.4. Asia-Pacific 3D Integrated Circuit Market By 3D Technology (USD Billion)

6.3.5. Asia-Pacific 3D Integrated Circuit Market By Application (USD Billion)

6.3.6. Asia-Pacific 3D Integrated Circuit Market By Country (USD Billion)

   6.3.6.1. China

   6.3.6.2. Japan

   6.3.6.3. Singapore

   6.3.6.4. India

   6.3.6.5. Rest of Asia-Pacific

6.4. Middle East and Africa (MEA) 3D Integrated Circuit Market (USD Billion)

6.4.1. Middle East and Africa 3D Integrated Circuit Market By Component (USD Billion)

6.4.2. Middle East and Africa 3D Integrated Circuit Market By Product (USD Billion)

6.4.3. Middle East and Africa 3D Integrated Circuit Market By Substrate (USD Billion)

6.4.4. Middle East and Africa 3D Integrated Circuit Market By 3D Technology (USD Billion)

6.4.5. Middle East and Africa 3D Integrated Circuit Market By Application (USD Billion)

6.4.6. Middle East and Africa 3D Integrated Circuit Market By Country (USD Billion)

   6.4.6.1. South Africa

   6.4.6.2. Rest of MEA

6.5. Central and South America 3D Integrated Circuit Market (USD Billion)

6.5.1. Central and South America 3D Integrated Circuit Market By Component (USD Billion)

6.5.2. Central and South America 3D Integrated Circuit Market By Product (USD Billion)

6.5.3. Central and South America 3D Integrated Circuit Market By Substrate (USD Billion)

6.5.4. Central and South America 3D Integrated Circuit Market By 3D Technology (USD Billion)

6.5.5. Central and South America 3D Integrated Circuit Market By Application (USD Billion)

6.5.6. Central and South America 3D Integrated Circuit Market By Country (USD Billion)

   6.5.6.1. Chile

   6.5.6.2. Brazil

   6.5.6.3. Rest of Central and South America

CHAPTER 7. Key Players and Strategic Developments

7.1. Taiwan Semiconductor Manufacturing Company, Ltd.

7.1.1. Business Overview

7.1.2. Product and Service Offering

7.1.3. Financial Overview

7.1.4. Strategic Developments

7.2. STMicroelectronics

7.2.1. Business Overview

7.2.2. Product and Service Offering

7.2.3. Financial Overview

7.2.4. Strategic Developments

7.3. Intel Corporation

7.3.1. Business Overview

7.3.2. Product and Service Offering

7.3.3. Financial Overview

7.3.4. Strategic Developments

7.4. Micron Technology Inc.

7.4.1. Business Overview

7.4.2. Product and Service Offering

7.4.3. Financial Overview

7.4.4. Strategic Developments

7.5. Xilinx Inc.

7.5.1. Business Overview

7.5.2. Product and Service Offering

7.5.3. Financial Overview

7.5.4. Strategic Developments

7.6. STATS ChipPAC Ltd.

7.6.1. Business Overview

7.6.2. Product and Service Offering

7.6.3. Financial Overview

7.6.4. Strategic Developments

7.7. United Microelectronics Corporation

7.7.1. Business Overview

7.7.2. Product and Service Offering

7.7.3. Financial Overview

7.7.4. Strategic Developments

7.8. Tezzaron Semiconductor Corporation

7.8.1. Business Overview

7.8.2. Product and Service Offering

7.8.3. Financial Overview

7.8.4. Strategic Developments

7.9. SK Hynix Inc.

7.9.1. Business Overview

7.9.2. Product and Service Offering

7.9.3. Financial Overview

7.9.4. Strategic Developments

7.10. IBM Corporation

7.10.1. Business Overview

7.10.2. Product and Service Offering

7.10.3. Financial Overview

7.10.4. Strategic Developments

Global Three Dimensional Integrated Circuits (3D ICs) Market Outlook, Trend and Opportunity Analysis, Competitive Insights, Actionable Segmentation and Forecast 2024